Your search returned 6 records. Click on the hyperlinks to view further details of Titles..
Magazine Name : Ieee Transactions On Components Packaging And Manufacturing Technology Part A
Year : 1994Volume number : 17Issue:04
A Cost-Benefit Analysis Model Of Product Design For Recyclability And Its Application(Article) Subject:
Recycling
,
Cost-Benefit
,
Dfe
Author:
Rosy
Chen
Fritz B.
Prinz
page:
502
-
507
Green Design An Introduction To Issues And Challenges(Article) Subject:
Author:
page:
508
-
514
Waste Minimization In Electronic Component Processing A Systems Approach(Article) Subject:
Author:
page:
514
-
520
Hazardous Waste Minimization In Iii-V Wafer Fabrication Processes(Article) Subject:
Author:
page:
521
-
526
Thermal Conductivity Of Molding Compounds For Plastic Packagin(Article) Subject:
Author:
page:
527
-
532
Fracture Properties Of Molding Compound Materials For Ic Plastic Packaging(Article) Subject:
Fracture Property
Author:
John
Suber
Trirat
Hongsmatip
page:
533
-
541